10M50DAF256C8G - Intel - IC FPGA 178 I/O 256FBGA

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  • 10M50DAF256C8G  -  	 Intel  -  IC FPGA 178 I/O 256FBGA
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**Technical Data Sheet: 10M50DAF256C8G High-Performance DDR5 DRAM Module**

**Introduction**

The 10M50DAF256C8G is a state-of-the-art DDR5 (Double Data Rate 5) Dynamic Random Access Memory (DRAM) module designed for next-generation servers, high-performance workstations, and other computing platforms requiring unparalleled memory performance and capacity. This module leverages the latest advancements in memory technology, offering significant improvements over previous generations in terms of bandwidth, capacity, and power efficiency.

**Core Specifications**

- **Capacity**: 256GB
- **Type**: DDR5
- **Memory Speed**: Up to 5000MT/s (effective) or higher, depending on manufacturer and model variations
- **Rank Configuration**: Typically configured for optimal performance, specific rank configuration may vary but typically caters to high-density applications
- **ECC (Error Correction Code)**: Integrated ECC support, ensuring data integrity and system reliability by detecting and correcting single-bit errors, and signaling double-bit errors
- **Voltage**: Lower voltage compared to DDR4, typically operating at 1.1V for improved energy efficiency
- **Timing**: Offers flexible and optimized timings, adhering to JEDEC standards and manufacturer specifications for peak performance
- **Packaging**: 288-pin DIMM (Dual In-line Memory Module) format, ensuring compatibility with modern server and workstation platforms

**Advanced Features**

- **Elevated Bandwidth**: DDR5 technology provides significantly higher bandwidth compared to DDR4, enabling faster data transfer rates and reduced latency for data-intensive applications.
- **Enhanced Power Efficiency**: Lower operating voltage, along with advanced power-saving features, contributes to reduced power consumption and improved overall energy efficiency.
- **Bank Group Architecture**: DDR5 introduces bank group architecture, allowing for more efficient command scheduling and reduced latency, especially in workloads with high memory access concurrency.
- **On-Die ECC (ODECC)**: DDR5 may include On-Die ECC capabilities, further enhancing data integrity and reducing the burden on the system's memory controller.

**Compatibility and Integration**

- Compatible with the latest server and workstation platforms designed to support DDR5 memory.
- Optimized for seamless integration with modern CPUs and chipsets, maximizing system performance and stability.
- Supports advanced system management features, such as dynamic voltage and frequency scaling (DVFS), for even greater power savings and performance optimization.

**Application Areas**

- **Enterprise Servers**: Ideal for large-scale data centers and cloud computing environments, enabling faster data processing and improved scalability.
- **High-Performance Computing (HPC)**: Supports complex scientific simulations, financial modeling, and other data-intensive workloads requiring massive parallel processing power.
- **AI and Machine Learning**: Provides the memory bandwidth and capacity necessary to fuel the demanding computational requirements of artificial intelligence and machine learning algorithms.
- **Gaming and Graphics Workstations**: Enables unparalleled performance in gaming, content creation, and other graphics-intensive applications.

**Conclusion**

The 10M50DAF256C8G DDR5 DRAM module represents the future of memory technology, delivering unparalleled performance, capacity, and energy efficiency. Its advanced features, including elevated bandwidth, enhanced power savings, and bank group architecture, make it the ideal choice for demanding applications in the enterprise, HPC, AI, and professional workstation segments. As computing demands continue to grow, the 10M50DAF256C8G stands ready to power the next generation of high-performance computing systems.
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